Thermal distribution of multiple LED module
نویسندگان
چکیده
Light-emitting diode (LED) is an electronic device with high heat flux. The simulation and analysis of the heat dissipation play an important role in the improvement of performance and design of LEDmodule. In this paper, a thermal model was developed using ANSYS software to simulate the temperature distribution of LED module. The effect of thermal conductivity of MCPCB (metal-core printed circuit board) substrate on the heat dissipation of LED module in the vertical direction and MCPCB substrate in the length and width direction was evaluated. A mathematical formula to describe the vertical temperature distribution of LED module was developed. The results showed that the maximum temperature of LED module and the temperature gradients near the outer edge of the contact surfaces between cooling blocks and MCPCB substrate decreased with the increase of thermal conductivity of MCPCB substrate. © 2015 Elsevier Ltd. All rights reserved.
منابع مشابه
Thermal Analysis of a high power LED multi-chip Package Module for Electronic Appliances
By using multiple high-power LEDs in products, some difficulties occur in predicting the temperature distribution because of the interaction of heat generated by each single-chip LED in the same module. To determine the heat dissipation of a multi-chip LED module, solid physical models for both single-chip and multi-chip LEDs with cooling fins were constructed. Simulation of the temperature dis...
متن کاملThermal analysis of a high power LED multi-chip package module
Some difficulties occur by using multiple high-power LEDs in products to predict the temperature distribution because of the interaction of heat generated by each single-chip LED in the same module. To determine the heat dissipation of a multi-chip LED module, solid physical models for both single-chip and multi-chip LEDs with cooling fins were constructed. Simulation of the temperature distrib...
متن کاملThree Dimensional Transient Numerical Modeling of Temperature Distribution and Output Power in Photovoltaic Module
According to the effect of temperature on the output power of a photovoltaic module, this research tries to calculate the temperature distribution in a photovoltaic module by numerical solving of the energy balance equations. Therefore, its output power can be accurately predicted. For this purpose, several photovoltaic modules are modeled in detail in the COMSOL software. A new method for calc...
متن کاملNumerical Modeling of the Shear Module of Alginate Micro-Beads under the Ultrasonic Thermal Effect
The mechanical properties of microscopic particles have been a heated research object for it takes the deformation of micro-beads in the microfluidic environment into account. Sufficient knowledge on mechanical properties of micro-beads would lead to better device design and application for cell mechanics, tissue engineering, etc. The physical properties of alginate beads were examined both in ...
متن کاملStudy on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System
Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED) packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging he...
متن کامل